Semiconductor Thinning Machine Market Share Driven by Advanced Packaging and Compound Semiconductor Demand | Valuates Reports

Semiconductor Thinning Machine Market Size

The global market for Semiconductor Thinning Machine was valued at US$ 1042 million in the year 2024 and is projected to reach a revised size of US$ 1699 million by 2031, growing at a CAGR of 7.1% during the forecast period.

Get Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-18O17151/Global_Semiconductor_Thinning_Machine_Market_Research_Report_2024?utm_source=Openpr&utm_medium=Referral

By Type
• 200mm Wafer
• 300mm Wafer

By Application
• Silicon Wafer
• Compound Semiconductors

Key Companies
Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation, NTS

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-18O17151/global-semiconductor-thinning-machine?utm_source=Openpr&utm_medium=Referral

The semiconductor thinning machine market is experiencing strong market growth, propelled by accelerating adoption of advanced packaging architectures, increasing demand for ultra‐thin wafers, and the rising use of compound semiconductors across automotive, power and 5G domains. Key market trends such as heterogeneous integration, wafer‐level packaging, and the shift from traditional silicon to SiC/GaN substrates are significantly influencing market size and driving equipment upgrades. Manufacturers are investing in precision grinding, polishing and thinning technologies to meet yield, thickness uniformity and throughput demands, reinforcing the broader market trends.

Within the type segment, the 300 mm wafer category currently holds the largest market share, due to its dominance in advanced logic, memory and packaging applications. Meanwhile, the "Others" category-which includes smaller‐diameter wafers and niche formats-is experiencing the fastest growth as legacy and specialty fabs upgrade thinning capacity for MEMS, power devices and compound semiconductor production. The 200 mm wafer segment also remains relevant, especially in mature node and power applications, rounding out the equipment demand profile for thinning machines.

In application terms, the silicon wafer segment commands the largest market share since the vast majority of semiconductor fabs deploy thinning equipment for silicon substrates. On the other hand, the compound semiconductor application segment is the fastest growing segment, as the industry increasingly transitions to SiC and GaN wafers for electric vehicles, renewable energy and RF front‐end devices. Together, these applications underscore the market growth potential across both mainstream and emerging wafer substrate types.

On the company front, prominent players such as DISCO Corporation and Tokyo Seimitsu Co., Ltd. (ACCRETECH) hold substantial market share, thanks to their established portfolios in ultra‐thin wafer grinding, polishing and metrology technologies. DISCO is widely cited as leading the market with the highest share and strong presence across Asia‐Pacific fabs, while Tokyo Seimitsu remains a strong regional competitor. Other companies such as Okamoto Machine Tool Works, Ltd., G&N Genauigkeits Maschinenbau Nürnberg GmbH, Revasum and Koyo Machinery Industries Co., Ltd. are demonstrating fastest growth by targeting compound semiconductor lines, full‐automatic systems and regional equipment localization initiatives. These firms' strategies around automation, integration with advanced packaging, and expanding into SiC/GaN processing drive their competitive momentum.

Regionally, the Asia‐Pacific region leads the market share thanks to its concentration of semiconductor manufacturing, OSAT and packaging operations, along with strong equipment demand from foundries in China, Taiwan and South Korea. The fastest growth region is also within the Asia‐Pacific cluster, where emerging fabs and capacity expansions for advanced packaging are accelerating equipment purchases. North America and Europe follow with growing but comparatively smaller shares, focusing on niche applications such as automotive power electronics and specialty devices. Looking ahead, the market forecast points to continued expansion in market size as wafer thinning requirements deepen, compound semiconductor adoption accelerates, automation and AI‐driven systems proliferate, and regional manufacturing diversification efforts gain traction.

Get Regional Report: https://reports.valuates.com/request/regional/QYRE-Auto-18O17151/Global_Semiconductor_Thinning_Machine_Market_Research_Report_2024?utm_source=Openpr&utm_medium=Referral

Email Id:
Please reach us at sales@valuates.com

Address:
Valuates,
4th Floor,
Balaraj's Arcade,
Whitefield Main road,
Bangalore 560066

Valuates offers an extensive collection of market research reports that helps companies to take intelligent strategical decisions based on current and forecasted Market trends.

This release was published on openPR.