Press release
Thermal Release Tape for Semiconductor Market Set to Surge - Key Insights You Must Know
Thermal Release Tape for Semiconductor MarketThe global market for Thermal Release Tape for Semiconductor was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
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North American market for Thermal Release Tape for Semiconductor is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Thermal Release Tape for Semiconductor is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
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The major global manufacturers of Thermal Release Tape for Semiconductor include Mitsui Chemicals Tohcello, Nitto Denko, Shenzhen Xinst Technology, NDS, Mingkun Technology, Solar Plus, NITTA, Koan Hao Technology, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
By Type
• PET Film
• PI Film
• Backing-free
By Application
• Back Grinding
• Dicing
Key Companies
Mitsui Chemicals Tohcello, Nitto Denko, Shenzhen Xinst Technology, NDS, Mingkun Technology, Solar Plus, NITTA, Koan Hao Technology
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